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Editorial Special Issue on “Memory Devices and Technologies for the Next Decade”

机译:关于“未来十年内存设备和技术”的编辑特别问题

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摘要

The expected explosive growth of big data, the Internet of Things, artificial intelligence, and 5G mobile networks will not only challenge but also offer new opportunities to solid-state memories in the next decade. Mainstream technologies such as the 3-D NAND Flash and the 1T-1C DRAM technology will have to keep evolving to prolong their scaling trends and maintain their undisputed leadership in the standalone memory arena. At the same time, other memory technologies may take advantage of the rise of the new market applications, likely changing the balance among cost, performance, and reliability. Phase-change memories (PCM), magnetoresistive random-access memories (MRAM), resistive random-access memories (ReRAM), and ferroelectric memories have the potential to play a role both in the embedded and in the standalone memory market. However, all of them will need innovations to fully demonstrate their long-term performance. Finally, all the memory technologies will have to compete to prove the benefits of new applications and solutions, such as the mixing of storage and computing with in-memory computing, neuromorphic computing, and nonvolatile logic.
机译:大数据的预期爆炸性增长,事物互联网,人工智能和5G移动网络不仅会挑战,而且还为未来十年的固态记忆提供了新的机会。 3-D NAND Flash和1T-1C DRAM技术等主流技术将不得不继续发展,以延长其扩展趋势,并在独立的记忆竞技场中维护无可争议的领导。与此同时,其他内存技术可能会利用新市场应用的兴起,可能会在成本,性能和可靠性之间改变平衡。相变存储器(PCM),磁阻随机接入存储器(MRAM),电阻随机接入存储器(RERAM)和铁电存储器具有在嵌入式和独立记忆市场中发挥作用的潜力。然而,所有这些都需要创新来充分展示他们的长期绩效。最后,所有内存技术都必须竞争以证明新应用和解决方案的好处,例如用内存计算,神经形态计算和非易失性逻辑的存储和计算的混合。

著录项

  • 来源
    《IEEE Transactions on Electron Devices》 |2020年第4期|1369-1372|共4页
  • 作者单位

    Politecn Milan Dipartimento Elettron Informaz & Bioingn I-20133 Milan Italy;

    Peking Univ Inst Microelect New Oxides Applicat Microelect Beijing 100871 Peoples R China|Peking Univ Elect Engn Comp Sci Sch Beijing 100871 Peoples R China;

    Macronix Int Hsinchu 300 Taiwan;

    Macronix Int Hsinchu 300 Taiwan;

    Samsung Elect Hwaseong 05340 South Korea|Samsung Elect Semicond Res & Dev Ctr Flash Memory Dev Hwaseong 05340 South Korea;

    Micron Technol Boise ID 83707 USA;

    Univ Massachusetts Amherst MA 01003 USA;

    Purdue Univ Elect & Comp Engn Fac W Lafayette IN 47907 USA;

  • 收录信息 美国《科学引文索引》(SCI);美国《工程索引》(EI);
  • 原文格式 PDF
  • 正文语种 eng
  • 中图分类
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