A Health Monitoring Method for Bond Wires in IGBT Modules Based on Voltage Ringing Characteristics

Lei Jing; Mingxing Du; Kexin Wei; William Gerard Hurley

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A Health Monitoring Method for Bond Wires in IGBT Modules Based on Voltage Ringing Characteristics

机译：基于电压振铃特性的IGBT模块键合线健康监测方法

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Bond wire failure is a common failure that seriously affects the reliability of insulated-gate bipolar transistor (IGBT) modules. Real-time health monitoring for bond wires is very important to avoid catastrophic failures. In this article, we introduce a

机译：键合线故障是一种常见故障，会严重影响绝缘栅双极晶体管（IGBT）模块的可靠性。实时监控焊线对避免灾难性故障非常重要。在本文中，我们介绍了

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来源
《IEEE Transactions on Electron Devices》 |2019年第9期|3953-3960|共8页
作者
Lei Jing; Mingxing Du; Kexin Wei; William Gerard Hurley;
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作者单位

School of Electrical and information Engineering Tianjin University Tianjin China;

Tianjin Key Laboratory of Control Theory and Applications in Complicated System Tianjin University of Technology Tianjin China;

Tianjin Key Laboratory of Control Theory;

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收录信息美国《科学引文索引》(SCI);美国《工程索引》(EI);
原文格式 PDF
正文语种 eng
中图分类
关键词
Wires; Insulated gate bipolar transistors; Monitoring; Temperature measurement; Temperature sensors; Voltage measurement; Current measurement;

机译：电线;绝缘栅双极型晶体管;监控;温度测量;温度传感器;电压测量电流量测;

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专利

1. A Novel Bond Wire Fault Detection Method for IGBT Modules Based on Turn-on Gate Voltage Overshoot [J] . Yang Yanyong, Zhang Pinjia IEEE Transactions on Power Electronics . 2021,第7期

机译：基于开启栅极电压过冲的IGBT模块的新型键合线故障检测方法
2. Bond wire lift-off monitoring based on intersection point movement characteristic in IGBT module [J] . Du Mingxing, Xin Jinlei, Wang Hongbin, Microelectronics Journal . 2021,第Octa期

机译：基于IGBT模块交叉点运动特性的键焊丝升降监测
3. Evaluation of $V_{rm ce}$ Monitoring as a Real-Time Method to Estimate Aging of Bond Wire-IGBT Modules Stressed by Power Cycling [J] . Smet V., Forest F., Huselstein J.-J., Industrial Electronics, IEEE Transactions on . 2013,第7期

机译：评估 $ V_ {rm ce} $ 监视作为一种实时方法来评估应力键合IGBT模块的老化通过电源循环
4. A temperature-independent method for monitoring the degradation of bond wires in IGBT modules based on transfer characteristics [C] . Yingzhou Peng, Pengju Sun, Luowei Zhou, Annual IEEE Applied Power Electronics Conference and Exposition . 2017

机译：基于转移特性的温度无关方法，用于监测IGBT模块中键合线的退化
5. Real-time internal temperature estimation and health monitoring for IGBT modules. [D] . Wang, Ze. 2017

机译：IGBT模块的实时内部温度估算和健康监控。
6. Optimized Electrode Locations for Wearable Single-Lead ECG Monitoring Devices: A Case Study Using WFEES Modules Based on the LANS Method [O] . Huaiyu Zhu, Yun Pan, Fan Wu, 2019

机译：可穿戴式单导心电图监测设备的最佳电极位置：以基于LANS方法的WFEES模块为例
7. Gate–Emitter Pre-threshold Voltage as a Health-Sensitive Parameter for IGBT Chip Failure Monitoring in High-Voltage Multichip IGBT Power Modules [O] . Richard Mandeya, Cuili Chen, Volker Pickert, 2019

机译：栅极 - 发射器预阈值电压作为EGBT芯片故障监控的Health敏感参数，在高压MultiChip IGBT电源模块中监控
8. Effects of Piezoelectric (PZT) Sensor Bonding and the Characteristics of the Host Structure on Impedance Based Structural Health Monitoring. [R] . Jalloh, Abdul 2005

机译：压电（pZT）传感器粘接效应及主体结构特性对阻抗结构健康监测的影响。

A Health Monitoring Method for Bond Wires in IGBT Modules Based on Voltage Ringing Characteristics

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