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首页> 外文期刊>Electron Devices, IEEE Transactions on >The Effect of Proton Irradiation in Suppressing Current Collapse in AlGaN/GaN High-Electron-Mobility Transistors
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The Effect of Proton Irradiation in Suppressing Current Collapse in AlGaN/GaN High-Electron-Mobility Transistors

机译:质子辐射对抑制AlGaN / GaN高电子迁移率晶体管电流崩塌的影响

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摘要

Almost complete suppression of dynamic ON-resistance in AlGaN/GaN high-electron-mobility transistors is obtained by proton irradiation. In this paper, both small and large power transistors are characterized before and after 3-MeV proton irradiation at different fluences. The irradiated devices show a high robustness and for specific fluences unaltered threshold voltage and static ON-resistance. However, for fluences higher than 1013cm−2, the dynamic ON-resistance is almost completely suppressed at 600 V and$T$= 150 °C. After irradiation, a measurable increase in OFF-state leakage current is observed, indicating an increase in the unintentionally doped (UID) GaN layer conductivity. We propose a technology computer-aided design supported model in which this conductivity increase leads to an increased deionization rate, ultimately reducing the dynamic ON-resistance.
机译:通过质子照射,几乎完全抑制了AlGaN / GaN高电子迁移率晶体管中的动态导通电阻。在本文中,无论大小,在功率密度不同的情况下,在3 MeV质子辐照之前和之后,功率晶体管的大小都会有所变化。受辐照的器件显示出很高的鲁棒性,并且对于特定的注量,阈值电压和静态导通电阻不变。但是,对于高于10的通量,n 13 ncm n −2,动态导通电阻在600 V和 n $ T $ n = 150°C。辐照后,观察到可测量的截止态漏电流增加,这表明非故意掺杂(UID)GaN层电导率增加。我们提出了一种技术计算机辅助设计支持的模型,其中,电导率的增加导致去离子率的提高,最终降低了动态导通电阻。

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