Efficient Heat Dissipation Study of High-Power${W}$-Band Sheet Beam Extended Interaction Oscillator

摘要

The microchannel cooling structure, as an efficient heat dissipation technology, is applied to improve the power capacity of a W-band continuous-wave (CW) sheet beam (SB) extended interaction oscillator. Its configuration is designed and optimized to further enhance the heat flux handling. The results show that microchannel cooling technology can greatly enhance the heat transfer efficiency. Specifically, the maximum temperature of the cavity drops from 308.9 °C to 144.9 °C. The power capacity of CW increases to 7 kW with 2% (49-kV and 2-A SB) electronic interception, and the tolerable electronic interception rate increases to 4% with 3.6-kW CW output power and 2.3-kW ohmic power loss. The microchannel cooling technology enables compact devices with higher frequencies and higher power to work under CW conditions.