机译:考虑缺陷和接触电阻的MWCNT局部互连的可变性研究-第二部分:电荷转移掺杂的影响
Microelectronics Department, LIRMM, CNRS, University of Montpellier, Montpellier, France;
Microelectronics Department, LIRMM, CNRS, University of Montpellier, Montpellier, France;
School of Engineering, University of Glasgow, Glasgow, U.K.;
School of Engineering, University of Glasgow, Glasgow, U.K.;
CEA-LITEN, University Grenoble Alpes, Grenoble, France;
CEA-INAC, University Grenoble Alpes, Grenoble, France;
CEA-INAC, University Grenoble Alpes, Grenoble, France;
School of Electronic and Information Engineering, Beihang University, Beijing, China;
School of Electronic and Information Engineering, Beihang University, Beijing, China;
Microelectronics Department, LIRMM, CNRS, University of Montpellier, Montpellier, France;
Synopsys Ltd., Glasgow, U.K.;
Synopsys Ltd., Glasgow, U.K.;
School of Engineering, University of Glasgow, Glasgow, U.K.;
CEA-LITEN, University Grenoble Alpes, Grenoble, France;
Microelectronics Department, LIRMM, CNRS, University of Montpellier, Montpellier, France;
Doping; Semiconductor process modeling; Charge transfer; Carbon; Semiconductor device modeling; Mathematical model; Conductivity;
机译:考虑缺陷和接触电阻的MWCNT局部互连的可变性研究-第一部分:原始MWCNT
机译:电子束诱导沉积(EBID)用石墨碳制造MWCNT-金属互连的超低电阻欧姆接触
机译:通过电荷转移掺杂和接触工程改进了与p型MoS_2晶体管的接触
机译:石墨烯上金属触点边缘的电荷转移区域及其对接触电阻测量的影响
机译:工程欧姆触点III-V,III-N和2D二均甲基化物:退火和表面制剂对接触电阻的影响
机译:通过电荷转移掺杂和接触工程改进了与p型MoS2晶体管的接触
机译:考虑缺陷和接触电阻MWCNT局部互连的变化研究 - 第二部分:电荷转移掺杂的影响
机译:接触表面间的传热与金属界面热接触电阻的分析和实验研究