...
首页> 外文期刊>Electron Devices, IEEE Transactions on >Compact Terahertz SPICE Model: Effects of Drude Inductance and Leakage
【24h】

Compact Terahertz SPICE Model: Effects of Drude Inductance and Leakage

机译:紧凑型太赫兹SPICE模型:德鲁德电感和泄漏的影响

获取原文
获取原文并翻译 | 示例
   

获取外文期刊封面封底 >>

       

摘要

We describe an improved compact SPICE/ADS model validated for the terahertz (THz) frequency range in a large dynamic range. The model validation was done by comparing the simulation results with the analytical THz detection theory and with the measured data for the 130-nm InGaAs/AlGaAs HFETs. This validation revealed the importance of the electron inertia and the crucial role of the gate and drain leakage currents at high intensities of the impinging THz radiation. The modeling results are in good agreement with the analytical THz detection theory and with the measured sub-THz response dependence on the bias, power, and polarization. It also demonstrates the response saturation previously measured at high intensities, and the resonant detection predicted by the detection theory for higher mobility devices. The model has been implemented in AIM-SPICE, ADS, and Cadence and could be used for design, characterization, and parameter extraction of sub-THz and THz devices and integrated circuits.
机译:我们描述了一种改进的紧凑型SPICE / ADS模型,该模型已针对大动态范围内的太赫兹(THz)频率范围进行了验证。通过将仿真结果与THz分析检测理论以及130 nm InGaAs / AlGaAs HFET的测量数据进行比较,完成了模型验证。该验证揭示了电子惯性的重要性以及在高入射THz辐射强度下栅极和漏极泄漏电流的关键作用。建模结果与分析性太赫兹检测理论以及所测得的次太赫兹响应对偏置,功率和极化的依赖性非常吻合。它还演示了先前在高强度下测得的响应饱和度,以及由检测理论预测的针对更高迁移率设备的谐振检测。该模型已在AIM-SPICE,ADS和Cadence中实现,可用于亚THz和THz器件以及集成电路的设计,表征和参数提取。

著录项

  • 来源
    《Electron Devices, IEEE Transactions on》 |2018年第12期|5350-5356|共7页
  • 作者单位

    Department of Electrical, Computer, and Systems Engineering, Rensselaer Polytechnic Institute, Troy, NY, USA;

    Department of Electrical, Computer, and Systems Engineering, Rensselaer Polytechnic Institute, Troy, NY, USA;

    Department of Electrical, Computer, and Systems Engineering, Rensselaer Polytechnic Institute, Troy, NY, USA;

    Department of Electronic Systems, Norwegian University of Science and Technology, Trondheim, Norway;

    Department of Electrical, Computer, and Systems Engineering, Rensselaer Polytechnic Institute, Troy, NY, USA;

  • 收录信息 美国《科学引文索引》(SCI);美国《工程索引》(EI);
  • 原文格式 PDF
  • 正文语种 eng
  • 中图分类
  • 关键词

    Logic gates; Integrated circuit modeling; Mathematical model; HEMTs; MODFETs; SPICE;

    机译:逻辑门;集成电路建模;数学模型;HEMT;MODFET;SPICE;

相似文献

  • 外文文献
  • 中文文献
  • 专利
获取原文

客服邮箱:kefu@zhangqiaokeyan.com

京公网安备:11010802029741号 ICP备案号:京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有
  • 客服微信

  • 服务号