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Performance Improvement of Scaled-Down Top-Contact OTFTs by Two-Step-Deposition of Pentacene

机译:并五苯两步沉积工艺可缩小按比例缩小的顶部接触OTFT的性能

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When scaling down to the channel length (L{sub}c) of 1.8 μm using a membrane shadow mask, top-contact pentacene thin-film transistors (TFTs) show that grain size dependency on the anomalous leakage current becomes conspicuous as L{sub}c is comparable to the grain size. For scaled-down OTFTs with large and small grain, the obvious difference of off-current in the depletion regime can be attributed to various reasons such as pentacene conductivity, parasitic resistance, locally ill-defined source/drain edge, and Au interdiffusion. To improve mobility as well as I{sub}(on)/I{sub}(off) ratio for scaled-down OTFTs, two-step-deposition (TSD) technique that enables us to control the channel conductivity in the depletion and accumulation regime as well as to improve the film continuity was proposed. To the best of our knowledge, the I{sub}(on)/I{sub}(off) ratio of 10{sup}7 and the mobility of 0.20 cm{sup}2/V·s for OTFTs with L{sub}c of 1.8 μm deposited by using the TSD technique was one of the best results in the literature.
机译:当使用薄膜荫罩将其缩小至1.8μm的沟道长度(L {sub} c)时,顶部接触并五苯薄膜晶体管(TFT)显示,随着L {sub } c与晶粒度相当。对于大尺寸和小尺寸的按比例缩小的OTFT,耗尽状态下的截止电流明显不同可以归因于多种因素,例如并五苯电导率,寄生电阻,局部不确定的源极/漏极边缘以及Au互扩散。为了提高按比例缩小的OTFT的迁移率以及I {sub}(on)/ I {sub}(off)比率​​,两步沉积(TSD)技术使我们能够控制耗尽和累积中的沟道电导率提出了一种改善膜连续性的方法。据我们所知,具有L {sub的OTFTs的I {sub}(on)/ I {sub}(off)比为10 {sup} 7,迁移率为0.20 cm {sup} 2 / V·s使用TSD技术沉积的1.8μm的} c是文献中最好的结果之一。

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