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High-Performance and Stable Transparent Hf–In–Zn–O Thin-Film Transistors With a Double-Etch-Stopper Layer

机译:具有双刻蚀停止层的高性能且稳定的透明Hf-In-Zn-O薄膜晶体管

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摘要

Transparent hafnium indium zinc oxide thin-film transistors adopting single- and double-etch-stopper layers were evaluated. Compared to devices with a single $hbox{SiO}_{x}$ etch stopper (ES) grown at 150 $^{circ}hbox{C}$, a double ES with a second $hbox{SiO}_{x}$ film grown at 350 $^{circ}hbox{C}$ provides a superior device performance such as improved subthreshold swing, threshold voltage, field effect mobility, and higher stability under a negative bias stress. The stretched-exponential analyses of the bias stress results indicate that the denser high-temperature $hbox{SiO}_{x}$ protects more effectively the underlying semiconductor during the source/drain etch process and suppresses the generation of defect states therein.
机译:对采用单蚀刻和双蚀刻停止层的透明ha铟锌氧化物薄膜晶体管进行了评估。与以150美元/小时的{box} hbox {C} $生长的单个$ hbox {SiO} _ {x} $蚀刻停止器(ES)的设备相比,具有第二个$ hbox {SiO} _ {{x}在350℃下生长的薄膜提供了优异的器件性能,例如改善的亚阈值摆幅,阈值电压,场效应迁移率以及在负偏置应力下的更高稳定性。偏应力结果的拉伸指数分析表明,致密的高温$ hbox {SiO} _ {x} $在源/漏蚀刻过程中能更有效地保护下面的半导体,并抑制其中的缺陷状态的产生。

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