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首页> 外文期刊>Electron Device Letters, IEEE >Field-Plate Structure Dependence of Current Collapse Phenomena in High-Voltage GaN-HEMTs
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Field-Plate Structure Dependence of Current Collapse Phenomena in High-Voltage GaN-HEMTs

机译:高压GaN-HEMT中电流崩塌现象的场板结构依赖性

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摘要

Four types of the field-plate (FP) structure were fabricated to discuss the relation between the current collapse phenomena and the electric-field peak in high-voltage GaN-HEMTs. The on -resistance increase caused by current collapse phenomena is dramatically reduced by the single-gate-FP and dual-FP structures compared with the source–FP structure, because the gate-edge electric field was reduced by the gate-FP electrode. The dual-FP structure was slightly more effective to suppress the collapse phenomena than the single-gate-FP structure, because the two-step FP structure relaxes the electric-field concentration at the FP edge. These results show that the gate-edge peak strongly affects the on -resistance modulation. Although the FP edge peak also causes the collapse phenomena, its influence is weak.
机译:制作了四种类型的场板(FP)结构,以讨论高压GaN-HEMT中电流崩塌现象与电场峰值之间的关系。与源极-FP结构相比,单栅极FP和双FP结构显着降低了由电流崩溃现象引起的导通电阻增加,因为栅极-边缘电极降低了栅极边缘电场。双FP结构比单栅极FP结构在抑制塌陷现象方面稍微更有效,因为两步FP结构使FP边缘处的电场集中松弛。这些结果表明,栅极边缘峰值强烈影响导通电阻调制。尽管FP边缘峰也引起塌陷现象,但其影响微弱。

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