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Full-Wafer Characterization of AlGaN/GaN HEMTs on Free-Standing CVD Diamond Substrates

机译:自由站立式CVD金刚石基板上的AlGaN / GaN HEMT的全晶片表征

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We report on electrical characterization and uniformity measurements of the first conventionally processed AlGaN/GaN high electron mobility transistors (HEMTs) on free-standing chemical-vapor-deposited (CVD) diamond substrate wafers. DC and RF device performance is reported on HEMTs fabricated on $sim!!hbox{130-}muhbox{m}$-thick and 30-mm round CVD diamond substrates without mechanical carrying wafers. A measured $f_{T} cdot L_{G}$ product of 12.5 $hbox{GHz} cdot muhbox{m}$ is the best reported data for all GaN-on-diamond technology. X-band power performance of AlGaN/GaN HEMTs on diamond is reported to be 2.08 W/mm and 44.1% power added efficiency. This letter demonstrates the potential for GaN HEMTs to be fabricated on CVD diamond substrates utilizing contact lithography process techniques. Further optimization of the epitaxy and diamond substrate attachment process could provide for improvements in thermal spreading while preserving the electrical properties.
机译:我们报告在独立的化学气相沉积(CVD)金刚石基板晶片上的第一个常规处理的AlGaN / GaN高电子迁移率晶体管(HEMT)的电特性和均匀性测量。在没有机械承载晶片的$ sim !! hbox {130-} muhbox {m} $厚和30毫米圆形CVD金刚石基板上制造的HEMT上,据报道具有DC和RF设备性能。测得的$ f_ {T} cdot L_ {G} $乘积为12.5 $ hbox {GHz} cdot muhbox {m} $的乘积是所有GaN-on-Diamond技术的最佳报告数据。据报道,AlGaN / GaN HEMT在金刚石上的X波段功率性能为2.08 W / mm,功率附加效率为44.1%。这封信证明了利用接触光刻工艺技术在CVD金刚石基板上制造GaN HEMT的潜力。外延和金刚石基底附​​接工艺的进一步优化可以提供热扩散的改善,同时保留电特性。

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