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A New Millimeter-Wave Fixture Deembedding Method Based on Generalized Cascade Network Model

机译:基于广义级联网络模型的毫米波夹具去嵌入新方法

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摘要

In this letter, a universal cascade-based deembedding technique was presented for on-wafer characterization of the RF CMOS device. As compared with existing deembedding approaches, it is developed based on unique combinations of two THRU structures that enable efficient deembedding of fixture parasitics without any inaccurate lumped approximation or requirement of known standards. The proposed deembedding technique is validated on 0.13- $muhbox{m}$ CMOS devices and has been proven to be more accurate than existing lumped and cascade-based deembedding techniques. As a result, it gives deeper physical prediction on transistor gate capacitances and transconductance. Therefore, it is highly suitable to be applied for device characterization at millimeter-wave frequencies.
机译:在这封信中,提出了一种通用的基于级联的去嵌入技术,用于RF CMOS器件的晶圆上表征。与现有的去嵌入方法相比,它是基于两个THRU结构的独特组合而开发的,这些结构可对夹具寄生虫进行有效的去嵌入,而无需任何不精确的集总近似或已知标准的要求。所提出的去嵌入技术已在0.13-muhbox {m} $ CMOS器件上得到验证,并且已被证明比现有的基于集总和基于级联的去嵌入技术更准确。结果,它可以对晶体管的栅极电容和跨导进行更深入的物理预测。因此,非常适合用于毫米波频率的器件表征。

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