首页> 外文期刊>Electron Device Letters, IEEE >Achieving High Field-Effect Mobility Exceeding 50 cm (^{mathrm {2}}) /Vs in In-Zn-Sn-O Thin-Film Transistors
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Achieving High Field-Effect Mobility Exceeding 50 cm (^{mathrm {2}}) /Vs in In-Zn-Sn-O Thin-Film Transistors

机译:在In-中实现超过50 cm的高场效应迁移率 (^ {mathrm {2}}) / Vs Zn-Sn-O薄膜晶体管

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摘要

Bottom gate and etch stopper-type thin-film transistors (TFTs) with a channel layer of indium–zinc–tin oxide were fabricated. The resulting TFTs exhibited a high mobility exceeding 52 cm (^{2}) /Vs, a low subthreshold gate swing of 0.2 V/decade, a threshold voltage of 0.1 V, and an (I_{mathrm{scriptstyle ON}/mathrm{scriptstyle OFF}}) ratio of (> 2times 10^{8}) . The stability of the oxide passivated device under the positive and negative bias stress conditions was superior to that of the nitride passivated device, which can be attributed to the lower trap density in the channel layer.
机译:制作了带有铟锌锌锡氧化物沟道层的底栅和蚀刻停止型薄膜晶体管(TFT)。所得的TFT表现出超过52 cm的高迁移率 (^ {2}) / Vs,低阈值门摆幅为0.2 V /十倍,阈值电压为0.1 V和 (I_ {mathrm {scriptstyle ON} / mathrm {scriptstyle OFF}})) (> 2×10 ^ {8}) 的-math> 比率。氧化物钝化器件在正和负偏置应力条件下的稳定性优于氮化物钝化器件,这可以归因于沟道层中较低的陷阱密度。

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