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首页> 外文期刊>Electron Device Letters, IEEE >Complete 3D-Reduced Surface Field Superjunction Lateral Double-Diffused MOSFET Breaking Silicon Limit
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Complete 3D-Reduced Surface Field Superjunction Lateral Double-Diffused MOSFET Breaking Silicon Limit

机译:完整的3D减小的表面场超结横向双扩散MOSFET突破了硅极限

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摘要

A new superjunction lateral double-diffused MOS with the semi-insulating poly silicon (SIPOS SJ-LDMOS) has been proposed in this letter, for the first time, with the complete three-dimensional reduced surface field (3D-RESURF). The SIPOS SJ-LDMOS along the three dimensions are subject to the electric field modulation, which achieves the complete 3D-RESURF effect. The simulated breakdown voltage (BV) for the unit length of the drift region is improved to 19.4 . The drift region with the high concentration compared with the conventional LDMOS can be depleted completely in the OFF-state to obtain the high BV. Moreover, the majority carrier accumulation can be formed to further decrease (specific on resistance) during the ON-state operation. Three effects have been combined to SIPOS SJ-LDMOS for the superjunction ideal, electric field modulation and the majority carrier accumulation by SIPOS. The tradeoff between the BV and has been improved to break through the silicon limit. The results show that the experimental of SIPOS SJ-LDMOS is 18 with the tested BV of 376 V, which is less than that of 31.1 for the -buffer SJ-LDMOS with the simulated BV of 287 V, and far less than 71.8 for the conventional LDMOS with the simulated BV of 254 V for the same drift region length of 20 .
机译:本文首次提出了一种具有半绝缘多晶硅的新型超结横向双扩散MOS(SIPOS SJ-LDMOS),具有完整的三维减小的表面场(3D-RESURF)。沿三个方向的SIPOS SJ-LDMOS都经过电场调制,从而实现了完整的3D-RESURF效果。漂移区单位长度的模拟击穿电压(BV)提高到19.4。与常规LDMOS相比,具有高浓度的漂移区可以在截止状态下完全耗尽,从而获得高BV。此外,可以形成多数载流子积累以在导通状态操作期间进一步减小(电阻率特定)。 SIPOS SJ-LDMOS结合了三种效应,可实现超结理想,电场调制和SIPOS积累多数载流子。 BV和BV之间的权衡已得到改进,可以突破硅限制。结果表明,SIPOS SJ-LDMOS的实验值为18,测试的BV为376 V,比模拟BV为287 V的-buffer SJ-LDMOS的31.1少,而远小于71.8。相同漂移区长度为20的传统LDMOS的模拟BV为254 V。

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