机译:片上Cu-石墨烯异质互连的电气建模
Key Laboratory of RF Circuits and Systems of Ministry of Education, Microelectronics CAD Center, Hangzhou Dianzi University, Hangzhou, China;
Conductivity; Graphene; Integrated circuit interconnections; Integrated circuit modeling; Nonhomogeneous media; Reliability; Wires; Cu-graphene heterogeneous interconnect; equivalent circuit model; graphene liner;
机译:Cu-Graphene异构互连的高频建模
机译:存在静电放电(ESD)时多级Cu-石墨烯异质互连的电热特性
机译:片上光学互连与用于高性能应用的电气互连
机译:Cu-石墨烯异质互连的建模与表征
机译:接近光速的片上电气互连。
机译:通过间隙连接通道门控的36状态模型将神经元互连的电突触的功能不对称性和可塑性
机译:片上互连,封装和3D集成中温度分布的电气建模