Modeling and characterization of Cu-graphene heterogeneous interconnects

摘要

In order to exploit graphene materials efficiently, some researcher have proposed Cu-graphene heterogeneous interconnects. In this study, an equivalent circuit model of such novel interconnect is presented, with the interfacial resistance treated appropriately. Then, the electrothermal characterization is carried out based on our self-developed TD-FEM algorithm. It is found that Cu-graphene heterogeneous interconnects could provide superior performance and reliability over the conventional Cu wires.