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Visible Flip-Chip Light-Emitting Diodes on Flexible Ceramic Substrate With Improved Thermal Management

机译:具有改善的热管理功能的柔性陶瓷基板上的可见倒装芯片发光二极管

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We demonstrate flip-chip light-emitting diodes (FC-LEDs) on a flexible yttria-stabilized zirconia (YSZ) substrate and compare them with FC-LEDs on a polymeric substrate. Degradation of luminescence intensity and red-shift of peak wavelength are not observed for the LED on the flexible YSZ, unlike one on the polyimide substrate, due to improved capability to remove the generated heat from the chip to the substrate. Thermal distribution measurements and finite-element simulations show improved thermal management by the flexible ceramic as compared with previously developed flexible LEDs on polymeric substrates. The results present an improved solution to high power operation of flexible LEDs.
机译:我们演示了在柔性氧化钇稳定的氧化锆(YSZ)基板上的倒装芯片发光二极管(FC-LED),并将它们与聚合物基板上的FC-LED进行了比较。与聚酰亚胺衬底上的LED不同,柔性YSZ上的LED并未观察到发光强度的下降和峰值波长的红移,这是由于提高了从芯片到衬底的散热能力。热分布测量和有限元模拟显示,与先前在聚合物基板上开发的柔性LED相比,柔性陶瓷改善了热管理。结果提供了一种改进的解决方案,用于柔性LED的高功率操作。

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