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Influence of Au-Based Metallization on the Phase Velocity of GaN on Si Surface Acoustic Wave Resonators

机译:硅基声波谐振器上基于金的金属化对GaN相速度的影响

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This letter presents a comparison between the phase velocity of Al and Ti/Au metallized GaN/Si-based surface acoustic wave structures. The resonance frequency (and consequently the phase velocity) is higher for Ti/Au-based metallization, especially when the acoustic wavelength has comparable values with the GaN layer thickness. Simulation results are in excellent agreement with the experiment. For example, the phase velocity on a 1--thin GaN layer with 200-nm finger/interdigit spacing width of the interdigitated transducer (IDT) is 3707 m/s (simulated value: 3840 m/s) for 100-nm-thin Al metallization and 4360 m/s (simulated value: 4240 m/s) for Ti/Au 5-/95-nm-thin metallization. This behavior was explained considering the effects of the significantly higher value of the acoustic impedance of Au compared with Al. The simulated mode shapes have confirmed this explanation. The advantage of the Ti/Au metallization lies in the possibility to obtain a higher resonance frequency for the same topology of the IDT.
机译:这封信介绍了Al和Ti / Au金属化GaN / Si基表面声波结构的相速度之间的比较。对于基于Ti / Au的金属化,谐振频率(因此,相速度)更高,尤其是当声波波长与GaN层厚度具有可比性时。仿真结果与实验非常吻合。例如,对于100nm的薄膜,指叉式换能器(IDT)的手指/指间的间距宽度为200nm的1-Thin GaN层上的相速度为3707 m / s(模拟值:3840 m / s)铝金属化和Ti / Au 5- / 95-nm薄金属化的4360 m / s(模拟值:4240 m / s)。考虑到Au的声阻抗值明显高于Al的影响,对此行为进行了解释。模拟模式形状已经证实了这种解释。 Ti / Au金属化的优点在于,对于IDT的相同拓扑,可以获得更高的谐振频率。

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