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ESD-Reliability Enhancement of Circular UHV 300-V Power nLDMOS by the Drain-side Superjunction Structure

机译:漏极侧超结结构增强了圆形特高压300V电源nLDMOS的ESD可靠性

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摘要

For circular ultra-high voltage (UHV) 300-V power nLDMOS devices, a novel device architecture of high voltage p-well (HVPW) zones is embedded into a high voltage n-well (HVNW) drift region to form superjunction (SJ) structures (radial-type). And, by the HVPW/HVNW SJ of the radial-type, eight types of area ratios are fabricated. However, the human-body model (HBM) capacity of this UHV nLDMOS reference group is only 2500 V. For equal partition radial-typeSJ, due tomore evenHVPW distribution in the equal 32-partitions, the HBM level (6750 V) was the highest. Meanwhile, it can maintain a fairly high breakdown voltage as with the reference sample. Finally, for the radial-type 30 equal partitions with different HVPW/HVNW area ratios, because the HVPW area was large in the HVPW/HVNW ratio(approximate to 2:1), more conduction current flowed into the BNW layer under these new inserted HVPWs and dispersed the conduction current; thus, the HBM (7000 V) was the best. Thus, the more even partition and higher proportion of HVPW/HVNW area ratio in drain-side SJ architecture, the stronger its electrostatic discharge reliability performance.
机译:对于圆形超高压(UHV)300V功率nLDMOS器件,高压p阱(HVPW)区域的新型器件架构被嵌入到高压n阱(HVNW)漂移区中以形成超结(SJ)结构(径向型)。并且,通过径向型的HVPW / HVNW SJ,制造了八种面积比。但是,此UHV nLDMOS参考组的人体模型(HBM)容量仅为2500V。对于等分径向型SJ,由于HVPW在等32个分区中分布更均匀,因此HBM级别(6750 V)最高。同时,它可以保持与参考样品相同的较高击穿电压。最后,对于具有不同HVPW / HVNW面积比的径向型30个相等的隔板,由于HVPW面积的HVPW / HVNW比例较大(大约为2:1),因此在这些新插入的情况下,更多的传导电流流入BNW层HVPWs并分散了传导电流;因此,HBM(7000 V)最好。因此,在漏极侧SJ架构中,HVPW / HVNW面积比的划分越均匀,比例越高,其静电放电可靠性就越强。

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