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Low-Loss Si-Substrates Enhanced Using Buried PN Junctions for RF Applications

机译:采用埋入式PN结增强了低损耗硅基板,适用于RF应用

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摘要

A novel method for increasing the effective resistivity in low-doped silicon substrates is presented. By creating a chain series of p-n depletion junctions beneath the insulator, the parasitic surface conduction channel is interrupted, significantly lowering substrate losses and reducing harmonic distortion in the simulated and measured CPW lines achieving performance close to the widely used trap-rich silicon substrate at RF frequencies.
机译:提出了一种提高低掺杂硅衬底中有效电阻率的新方法。通过在绝缘体下方创建一系列的pn耗尽结链系列,寄生表面传导通道被中断,从而显着降低了基板损耗并减少了模拟和测量的CPW线路中的谐波失真,从而实现了与射频下广泛使用的陷阱富集硅基板接近的性能频率。

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