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首页> 外文期刊>IEEE Electron Device Letters >Multi-Channel AlGaN/GaN Lateral Schottky Barrier Diodes on Low-Resistivity Silicon for Sub-THz Integrated Circuits Applications
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Multi-Channel AlGaN/GaN Lateral Schottky Barrier Diodes on Low-Resistivity Silicon for Sub-THz Integrated Circuits Applications

机译:低阻抗硅上的多通道AlGaN / GaN横向肖特基势垒二极管,用于次THz集成电路应用

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摘要

This paper presents novel multi-channel RF lateral Schottky-barrier diodes (SBDs) based on AlGaN/GaN on low resistivity (LR) (sigma = 0.02 Omega.cm) silicon substrates. The developed technology offers a reduction of 37 % in onset voltage, V-ON (from 1.34 to 0.84 V), and 36 % in ON-resistance, R-ON (1.52 to 0.97 to Omega.mm) as a result of lowering the Schottky barrier height, Phi(n), when compared to conventional lateral SBDs. No compromise in reverse-breakdown voltage and reverse-bias leakage current performance was observed as both multi-channel and conventional technologies exhibited V-BV of (V-BV > 30 V) and I-R of (I-R < 38 mu A/mm), respectively. Furthermore, a precise small-signal equivalent circuit model was developed and verified for frequencies up to 110 GHz. The fabricated devices exhibited cut-off frequencies of up to 0.6 THz, demonstrating the potential use of lateral AlGaN/GaN SBDs on LR silicon for high-efficiency, high-frequency integrated circuits applications.
机译:本文介绍了基于低电阻率(LR)(sigma = 0.02Ω·cm)硅基板上的AlGaN / GaN的新型多通道RF横向肖特基势垒二极管(SBD)。通过降低电压,开发的技术可将启动电压V-ON(从1.34降低至0.84 V)降低37%,将导通电阻R-ON(从1.52降低至0.97至Omega.mm)降低36%。与常规的横向SBD相比,肖特基势垒高度Phi(n)。由于多通道和常规技术均显示V-BV为(V-BV> 30 V)和IR为(IR <38μA / mm),因此未观察到反向击穿电压和反向偏置泄漏电流性能的降低,分别。此外,开发了精确的小信号等效电路模型,并验证了高达110 GHz的频率。所制造的器件表现出高达0.6 THz的截止频率,证明了在LR硅上使用横向AlGaN / GaN SBD的潜力,可用于高效,高频集成电路应用。

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