CST teams with Cadence on PCB, package co-design

摘要

CST (Computer Simulation Technology) recently signed a joint-marketing agreement with Cadence Design Systems. Cadence and CST are collaborating to offer an effective workflow for PCB and package-layout co-design in high-speed and mixed-RF systems. The companies report that their applications teams will work together to address customer requirements.The fact that chip packages and PCBs operating at high speeds can experience unwanted noise, reflections, and crosstalk, as well as other undesirable effects that can affect performance and energy consumption, spurred the companies to collaborate to solve these problems.