Lead frame technology enables slimmest chip package

摘要

Dai Nippon Printing Co. Ltd's (DNP) newly developed lead frame technology enables a semiconductor package with a thickness of 0.15mm, or approximately l/20th the thickness of existing general products. In line with the shift to more compact and increasingly high performance in a variety of electronic device, there has been a sharp pick up in demands for the further downsizing, slimming down and higher densification of semiconductor packages. There has been a subsequent expansion in the market for packaging, which mounts semiconductors on a three dimensional basis.