AlSiC Offers Thermal Management for Electronic Packaging

摘要

Designing highly reliable microwave electronics, microelectronics, optoelectronics and power semiconductor systems at a low cost is not an unattainable goal if utilizing the most advanced materials. Because the thermal management of electronics packaging and substrates is required to ensure the reliability of these devices, engineers require materials that provide thermal management while achieving optimal power density in smaller designs. Producing these materials at a low cost requires a robust forming process that meets the functional needs of the packaging design. AlSiC (Aluminum Silicon Carbide), a metal-matrix composite, provides highly reliable and cost-effective thermal management solutions for electronic packaging. It offers high thermal conductivity (～ 200 W/ mK) and a tai- lored, low Coefficient of Thermal Expansion (CTE). The low density and high strength and stiffness values give AlSiC added advantages over more dense, traditional materials in applications where weight savings or shock and vibration tolerance are required.