Suppressed Growth of (Fe, Cr, Co, Ni, Cu)Sn2 Intermetallic Compound at Interface between Sn-3.0Ag-0.5Cu Solder and FeCoNiCrCu0.5 Substrate during Solid-state Aging

摘要

High-entropy alloys (HEAs) are promising materials for next-generation applications because of their mechanical properties, excellent high-temperature stability, and resistance against oxidation and corrosion. Although many researchers have investigated high-temperature HEA applications, few have considered low-temperature applications. Here we demonstrate an unprecedented intermetallic compound of (Fe, Cr, Co, Ni, Cu)Snsub2/sub at the interface between Sn-3.0Ag-0.5Cu (SAC) solder and FeCoNiCrCusub0.5/sub HEA substrate after reflow at 400?°C. Significantly suppressed growth of intermetallic compound without detachment from the substrate was observed during thermal aging at 150?°C for 150?h. Sn grains with an average grain size of at least 380 μm are observed. The results reveal a completely new application for the fields of Sn-Ag-Cu solder and HEA materials.