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Design of 100-V Super-Junction Trench Power MOSFET with Low On-Resistance

机译:具有低导通电阻100V超结沟沟功率MOSFET的设计

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Power metal-oxide semiconductor field-effect transistor (MOSFET) devices are widely used in power electronics applications, such as brushless direct current motors and power modules. For a conventional power MOSFET device such as trench double-diffused MOSFET (TDMOS), there is a tradeoff relationship between specific on-state resistance and breakdown voltage. To overcome the tradeoff relationship, a super-junction (SJ) trench MOSFET (TMOSFET) structure is studied and designed in this letter. The processing conditions are proposed, and studies on the unit cell are performed for optimal design. The structure modeling and the characteristic analyses for doping density, potential distribution, electric field, width, and depth of trench in an SJ TMOSFET are performed and simulated by using of the SILVACO TCAD 2D device simulator, Atlas. As a result, the specific on-state resistance of 1.2 mΩ-cm2 at the class of 100 V and 100 A is successfully optimized in the SJ TMOSFET, which has the better performance than TDMOS in design parameters.
机译:电力金属 - 氧化物半导体场效应晶体管(MOSFET)器件广泛用于电力电子应用,例如无刷直流电机和电源模块。对于诸如沟槽双漫反射MOSFET(TDMOS)的传统功率MOSFET装置,在特定的导通电阻和击穿电压之间存在权衡关系。为了克服权衡关系,在这封信中研究和设计了一个超级接头(SJ)沟槽MOSFET(TMOSFET)结构。提出了处理条件,并对单元电池进行研究以进行最佳设计。通过使用Silvaco TCAD 2D设备模拟器,Atlas进行SJ TMOSFET中的掺杂密度,电位分布,电场,宽度和沟槽深度的结构建模和特性分析。结果,在SJ TMOSFET中成功优化了100V和100 A类的1.2MΩ-cm2的特定导通电阻,其性能比设计参数中的TDMO更好。

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