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Comparative Methods Of Measurement Of Contact Resistivity Of Metal-Semiconductor Contact

机译:金属-半导体接触件接触电阻率测量的比较方法

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In this paper, comparison of mathematical models to determine contact resistivity of Metal-Semiconductor (M-S) contacts is made. Contact resistivity of M-S contact is obtained using a mathematical model based on the values of ideality factor and barrier height which are obtained from Current–voltage (I-V) characteristics of M-S contact. Contact resistivity of M-S contact is obtained using another mathematical model based on two tuning-parameters. Contact resistivity of M-S contact is also obtained using Shockley’s standard Transmission Line Model (TLM) technique. Thin films of Cd1-xZnxTe of 1μm thickness for ‘x’ varying from 0.0567 to 0.2210 are the semiconductor materials fabricated on Nickel coated glass substrates and large work function Nickel is the contact points on these films. I-V characteristic data are recorded from these Ni-Cd1-xZnxTe stuctures. The values of contact resistivity of the M-S contacts obtained from these three methods are compared and the results are found to match well.
机译:本文对确定金属-半导体(M-S)接触电阻率的数学模型进行了比较。 M-S接触的接触电阻率是使用数学模型基于理想因子和势垒高度的值获得的,理想值和势垒高度是根据M-S接触的电流-电压(I-V)特性获得的。使用另一个基于两个调整参数的数学模型,可以获得M-S接触的接触电阻率。还可以使用Shockley的标准传输线模型(TLM)技术获得M-S接触的接触电阻率。厚度为1μm的Cd1-xZnxTe薄膜,其“ x”值从0.0567到0.2210不等,是在镀镍玻璃基板上制造的半导体材料,大功函镍是这些膜上的接触点。从这些Ni-Cd1-xZnxTe结构记录了I-V特征数据。比较了从这三种方法获得的M-S触点的接触电阻率值,发现结果非常匹配。

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