首页> 外国专利> SPECIFIC CONTACT RESISTIVITY MEASUREMENT METHOD, SEMICONDUCTOR DEVICE FOR SPECIFIC CONTACT RESISTIVITY MEASUREMENT, AND METHOD FOR MANUFACTURING THE SAME

SPECIFIC CONTACT RESISTIVITY MEASUREMENT METHOD, SEMICONDUCTOR DEVICE FOR SPECIFIC CONTACT RESISTIVITY MEASUREMENT, AND METHOD FOR MANUFACTURING THE SAME

机译:特定的接触电阻率测量方法,用于特定的接触电阻率测量的半导体装置及其制造方法

摘要

A test structure, a method of employing the test structure, and a method of manufacturing the test structure are provided for measuring a contact resistance between a silicide and a semiconductor. The test structure includes a set of silicide layers separated from one another and upon which electrodes from a set of electrodes are placed. One pair of electrodes is employed to force a constant current through the silicide layers and a diffusion layer of a semiconductor substrate of the test structure. Another pair of electrodes determines a potential drop between the silicide layers and the diffusion layer. Based upon the constant current and the potential drop determined, a contact resistance is extracted.
机译:提供一种用于测量硅化物与半导体之间的接触电阻的测试结构,采用该测试结构的方法以及制造该测试结构的方法。该测试结构包括彼此分离的一组硅化物层,并且在该硅化物层上放置了来自一组电极的电极。使用一对电极来迫使恒定电流通过测试结构的半导体衬底的硅化物层和扩散层。另一对电极确定了硅化物层和扩散层之间的电势降。基于恒定电流和确定的电势降,提取接触电阻。

著录项

  • 公开/公告号US2012242356A1

    专利类型

  • 公开/公告日2012-09-27

    原文格式PDF

  • 申请/专利权人 KAZUYA OHUCHI;NAOKI KUSUNOKI;

    申请/专利号US201113070704

  • 发明设计人 NAOKI KUSUNOKI;KAZUYA OHUCHI;

    申请日2011-03-24

  • 分类号G01R27/08;H01L21/28;H01L29/40;

  • 国家 US

  • 入库时间 2022-08-21 17:34:30

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