Characterization and Control of Hole Missing Defect in EUV Patterning

摘要

Towards realistic adoption of EUV technology, material/process induced defect must be considerable problem. Several excellent studies have been introduced before and it mainly focused on the relation between defect number and pattern size and pattern pitch. Unfortunately, the study related defect transfer behavior have not been quite few, despite defect inspection is executed through top-down SEM.