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首页> 外文期刊>Journal of Minerals and Materials Characterization and Engineering >Surface Characterization of Metallic Particles in Printed Circuit Board Comminution Fines and the Processing Implication
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Surface Characterization of Metallic Particles in Printed Circuit Board Comminution Fines and the Processing Implication

机译:印刷电路板粉碎粉中金属颗粒的表面表征及其加工意义

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From the background of poor responses of metallic particles in printed circuit board comminution fines to chemical conditioning froth flotation schemes, contrary to expectations based on native metal flotation, surface studies were carried out on samples of these metallic particles in quest for the probable causatives. Auger electron spectroscopy combined with argon beam depth profiling was employed in studying the surface make-up of the metal particles. The composition profiles down to 340 nm surface depth obtained showed that the supposed metallic particles consist of organics, oxides, and various trace alloys different from the bulk material of the particles. The profiles reveal the peculiar surfaces of the particles and the matrix from which the particles were liberated. The study provides insight for better appraisal of the flotation system the sample presents. Implementing chemical conditioning flotation scheme on this sample must carefully consider the peculiar surface make up in contrast to native metal occurrences.
机译:从印刷电路板粉碎细粉中金属颗粒对化学调理泡沫浮选方案反应不佳的背景出发,与基于天然金属浮选的预期相反,对这些金属颗粒的样品进行了表面研究,以寻找可能的原因。俄歇电子能谱结合氩气束深度剖析被用于研究金属颗粒的表面组成。获得的低至340 nm表面深度的成分分布图表明,假定的金属颗粒由有机物,氧化物和各种微量合金组成,这些金属与颗粒的主体材料不同。该轮廓揭示了颗粒和从中释放出颗粒的基质的特殊表面。该研究为更好地评估样品所呈现的浮选系统提供了见识。在该样品上实施化学条件浮选方案必须仔细考虑与天然金属的形成相反的特殊表面组成。

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