废印刷电路板非金属粉负载二氧化硅杂化填料的制备及其在不饱和聚酯中的应用

摘要

为增强废印刷电路板非金属粉(WPCBP)与聚合物基体之间的界面结合作用,采用溶胶-凝胶法在WPCBP表面原位负载了一层纳米二氧化硅粒子(SiO2),制备了一种新型的WPCBP-SiO2杂化填料.SEM、TGA和FTIR证明SiO2通过化学键成功负载到了杂化填料的表面.采用含双键的界面改性剂对杂化填料进行改性后,应用于不饱和聚酯树脂基体,探讨了未改性杂化填料及表面改性杂化填料对不饱和聚酯复合材料的力学性能、界面结合作用和热稳定性能的影响.结果表明,新型的杂化填料WPCBP-SiO2能够与不饱和聚酯基体形成强的界面结合作用,显著提高不饱和聚酯复合材料的力学性能和热稳定性能,且表面改性后复合材料的各项性能得到进一步提高.%To strengthen the interfacial interaction between waste printed circuit boards powders (WPCBP) and polymer matrix,WPCBP was immobilized a layer of SiO2 nanoparticles to form a novel WPCBP-SiO2 hybrid filler by sol-gel method.SEM,TGA and FTIR suggested that SiO2 nanoparticles were chemically bonded onto the surface of WPCBP.Then WPCBP-SiO2 hybrid filler was modified with a silane coupling agent and incorporated in unsaturated polyester resin (UPE) matrix.The effect of WPCBP-SiO2 hybrid filler on mechanical properties,interfaeial bonding and thermal stability of UPE composites were comprehensively explored.It has been confirmed that WPCBP-SiO2 hybrid filler could form a strong interfacial interaction with polymer matrix,and markedly enhance the mechanical properties and thermal stability of UPE composites.Besides,the modification of hybrid filler give further improvements of UPE composites.