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Thermal Transport between Graphene Sheets and SiC Substrate by Molecular-Dynamical Calculation

机译:石墨烯片与SiC衬底之间的热力学传递的分子动力学计算

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Using nonequilibrium molecular dynamics, we investigate the mechanisms of thermal transport across SiC/graphene sheets. In simulations, 3C-, 4H-, and 6H-SiC are considered separately. Interfacial thermal resistances between Bernal stacking graphene sheets and SiC (Si- or C-terminated) are calculated at the ranges of 100 K~700 K. The results indicate, whether Si-terminated or C-terminated interface, the interfacial thermal resistances of 4H- and 6H-SiC have similar trends over temperatures. Si-terminated interfacial thermal resistances of 3C-SiC are higher than those of 4H- and 6H-SiC in a wide temperature range from 100 K to 600 K. But, for C-rich interface, this range is reduced from 350 K to 500 K.
机译:使用非平衡分子动力学,我们研究了跨SiC /石墨烯片的热传输机理。在仿真中,分别考虑了3C-,4H-和6H-SiC。计算了贝尔纳堆叠石墨烯片与SiC(Si或C端基)之间的界面热阻,范围为100 K〜700 K,结果表明,无论是Si端接还是C端接的界面,界面热阻均为4H -和6H-SiC在温度上的变化趋势相似。在100 K至600 K的宽温度范围内,3C-SiC的硅端接界面热阻高于4H和6H-SiC,但是对于富C界面,此范围从350 K减小至500 K.

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