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High-Performance Solution-Processed Amorphous InGaZnO Thin Film Transistors with a Metal–Organic Decomposition Method

机译:金属-有机分解法高性能固溶处理非晶InGaZnO薄膜晶体管

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A facile solution process was introduced for the preparation of IGZO thin films via a metal–organic decomposition (MOD) method. The IGZO ink was synthesized by mixing the solutions of gallium acetylacetonate [Ga(C5H7O2)3], zinc acetylacetonate hydrate [Zn(C5H7O2)2·xH2O] dissolved in ethanol, and indium acetylacetonate [In(C5H7O2)3] dissolved in tetrahydrofuran (THF). The deposited films by spin-coating were annealed at moderate process temperature (≤500°C). The relationship between device performance and postannealing temperature was studied. The result demonstrated that mobility of IGZO TFT increased as the annealing temperature increased. Based on the analysis of O 1s statement, the annealing temperature can influence the number of oxygen vacancy to further affect the carrier centration. In addition, the IGZO TFT devices with various Ga molar ratios were compared to demonstrate the influence of the Ga addition. The result demonstrated that the saturated mobilities () decreased and shifted to positive voltage as the Ga molar ratio was increased. It is likely that Ga can offer stronger chemical bonds between metal and oxygen that reduced the concentration of free carriers and thus help reducing . As a result, the optimized performance of IGZO TFT with the mobility of 3.4?cm2V?1s?1 showed the MOD process was a promising approach.
机译:通过金属-有机分解(MOD)方法引入了一种简便的溶液工艺来制备IGZO薄膜。 IGZO油墨是通过混合乙酰丙酮镓[Ga(C5H7O2)3],乙酰丙酮锌水合物[Zn(C5H7O2)2·xH2O]和溶于四氢呋喃的乙酰丙酮铟[In(C5H7O2)3]的溶液来合成的THF)。通过旋涂沉积的薄膜在适当的工艺温度(≤500°C)下退火。研究了器件性能与退火后温度之间的关系。结果表明,IGZO TFT的迁移率随退火温度的升高而增加。根据对O 1s陈述的分析,退火温度会影响氧空位的数量,进而影响载流子的浓度。另外,比较了具有各种Ga摩尔比的IGZO TFT器件,以证明Ga添加的影响。结果表明,随着Ga摩尔比的增加,饱和迁移率()减小并转变为正电压。 Ga有可能在金属和氧之间提供更牢固的化学键,从而降低了自由载流子的浓度,从而有助于降低载流子的浓度。结果,IGZO TFT的迁移率达到3.4?cm2V?1s?1的优化性能表明MOD工艺是一种有前途的方法。

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