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Embedded Memory Hierarchy Exploration Based on Magnetic Random Access Memory

机译:基于磁性随机存取存储器的嵌入式存储器层次结构探索

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Static random access memory (SRAM) is the most commonly employed semiconductor in the design of on-chip processor memory. However, it is unlikely that the SRAM technology will have a cell size that will continue to scale below 45 nm, due to the leakage current that is caused by the quantum tunneling effect. Magnetic random access memory (MRAM) is a candidate technology to replace SRAM, assuming appropriate dimensioning given an operating threshold voltage. The write current of spin transfer torque (STT)-MRAM is a known limitation; however, this has been recently mitigated by leveraging perpendicular magnetic tunneling junctions. In this article, we present a comprehensive comparison of spin transfer torque-MRAM (STT-MRAM) and SRAM cache set banks. The non-volatility of STT-MRAM allows the definition of new instant on/off policies and leakage current optimizations. Through our experiments, we demonstrate that STT-MRAM is a candidate for the memory hierarchy of embedded systems, due to the higher densities and reduced leakage of MRAM. We demonstrate that adopting STT-MRAM in L1 and L2 caches mitigates the impact of higher write latencies and increased current draw due to the use of MRAM. With the correct system-on-chip (SoC) design, we believe that STT-MRAM is a viable alternative to SRAM, which minimizes leakage current and the total power consumed by the SoC.
机译:静态随机存取存储器(SRAM)是片上处理器存储器设计中最常用的半导体。但是,由于量子隧穿效应引起的泄漏电流,SRAM技术不太可能具有继续缩小到45 nm以下的单元尺寸。磁随机存取存储器(MRAM)是替代SRAM的候选技术,假设在给定工作阈值电压的情况下尺寸合适。自旋传递扭矩(STT)-MRAM的写入电流是已知限制;然而,最近已经通过利用垂直的磁性隧道结减轻了这种情况。在本文中,我们对自旋转移矩MRAM(STT-MRAM)和SRAM高速缓存集库进行了全面比较。 STT-MRAM的非易失性允许定义新的即时开/关策略和泄漏电流优化。通过我们的实验,我们证明了STT-MRAM由于具有更高的密度和减少的MRAM泄漏而成为嵌入式系统内存层次结构的候选者。我们证明了在L1和L2缓存中采用STT-MRAM可以减轻由于使用MRAM而导致的更高写入延迟和更大电流消耗的影响。通过正确的片上系统(SoC)设计,我们相信STT-MRAM是SRAM的可行替代方案,它可以最大程度地降低泄漏电流和SoC消耗的总功耗。

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