Surface Microstructuring of Inclined Trench Structures of Silica Glass by Laser-induced Backside Wet Etching

摘要

We have investigated a one-step method to fabricate a microstructure on a silica glass plate by using laser-induced backside wet etching (LIBWE) that consists of diode-pumped solid state (DPSS) laser beam scanning system. The focused laser beam of a DPSS UV laser at |? = 266 nm on the repetition rate of 10 kHz was directed to the sample cell of the glass. Deep vertical microtrenches having an aspect ratio of ca. 6 were fabricated on the surfaces of silica glass. Inclined trench structures at the angle of 60 degree were successfully fabricated by changing the incident angle of the laser beam onto the glass surface through an equilateral prism at the normal incidence of the laser baem.