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Development of a Convenient in situ UHV Scanning Tunneling Potentiometry System Using a Tip Holder Equipped with Current-Injection Wires

机译:使用配有电流注入线的尖端支架开发便捷的原位特高压扫描隧道电位系统

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Scanning tunneling potentiometry (STP) is one of the advanced variations of scanning tunneling microscopy (STM). By combining STM and STP, the local structures and potential distribution on conducting samples with a lateral current flowing along the sample surface can be measured simultaneously with a high spatial resolution. However, additional electrodes are necessary to make the current flow along the sample surface, which can sometimes be difficult to handle. We developed a new type of STM tip holder that makes it easier to perform in situ STM/STP measurements in ultrahigh vacuum (UHV), prepare a sample and transfer the sample/tip. Using this tip holder, a Si(111)-√3×√3-Ag surface and Bi(111) films grown on Si(111) were measured using STP. For the Si(111)-√3×√3-Ag surface, abrupt potential drops at the atomic steps in the topographic images are observed. On the other hand, for the Bi film, a nearly homogeneous potential gradient is observed along the direction of the electric current without potential drops at the steps on the surface. By combining numerical simulation and atomic-scale resolved STM images, it is shown that the current distribution is not homogeneous at all, even at nanometer scales. This is due to a wide range of scatter in the resistances across steps, irrespective of the step height. This originates from difference in the ratio of the conductivity at the steps to that on the terraces between the two material systems. [DOI: 10.1380/ejssnt.2016.216]
机译:扫描隧道电位法(STP)是扫描隧道显微镜(STM)的高级变体之一。通过将STM和STP结合使用,可以同时以高空间分辨率同时测量沿样品表面流动的带有横向电流的导电样品上的局部结构和电势分布。但是,需要额外的电极才能使电流沿着样品表面流动,这有时可能很难处理。我们开发了一种新型的STM吸头支架,可以更轻松地在超高真空(UHV)中执行原位STM / STP测量,准备样品以及转移样品/吸头。使用该尖端支架,使用STP测量Si(111)-√3×√3-Ag表面和在Si(111)上生长的Bi(111)膜。对于Si(111)-√3×√3-Ag表面,在形貌图像中观察到原子阶跃处的突然电势下降。另一方面,对于Bi膜,沿着电流方向观察到几乎均匀的电势梯度,而在表面的台阶处没有电势下降。通过将数值模拟和原子级解析的STM图像相结合,可以看出,即使在纳米级,电流分布也不是均匀的。这是由于跨步电阻的分散范围广,与步高无关。这是由于两种材料体系之间的台阶上的电导率与台阶上的电导率之比不同而引起的。 [DOI:10.1380 / ejssnt.2016.216]

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