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Evaluation of Interfacial Bonding Utilizing Ag2O-Derived SilverNanoparticles Using TEM Observation and Molecular DynamicsSimulation

机译:利用TEM观察和分子动力学模拟评估Ag2O衍生的银纳米粒子的界面键合

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The interfacial bonding utilizing Ag2O-derived silver nanoparticles was evaluated using TEM observation andmolecular dynamics simulation. The TEM observation reveals that the crystal orientation of the sintered silvercorresponded to that of the gold substrate. This is considered that the epitaxial layer of silver was formed through in-situformation of silver nanoparticles from Ag2O paste, and oriented in the direction of the gold crystal. MD simulationsuccessfully recreated the sintering behavior of silver nanoparticles and the gold substrate. The simulation results clearlyshowed the epitaxial layers of silver atoms were formed on the substrate. The existence of the closed pore indicates theacceleration of the sintering between nanoparticles and the gold substrate to minimize the total sum of surface energy andgrain boundary energy.
机译:使用TEM观察和分子动力学模拟评估了利用Ag2O衍生的银纳米颗粒的界面键合。 TEM观察表明,烧结银的晶体取向与金基底的晶体取向相对应。这被认为是通过从Ag 2 O糊剂中原位形成银纳米颗粒而形成的银外延层,并沿金晶体的方向取向。 MD模拟成功地重现了银纳米颗粒和金基底的烧结行为。仿真结果清楚地表明,在基底上形成了银原子的外延层。闭孔的存在表明纳米粒子和金基底之间的烧结加速,从而使表面能和晶界能的总和最小化。

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