INTERFACIAL BONDING FORCE EVALUATION METHOD

摘要

The present invention relates to a method of evaluating an interfacial bonding force. According to the present invention, a method of evaluating the interfacial bonding force comprises: a step of measuring a maximum indentation load (L_max) and a maximum indentation depth (h_max); a step of calculating a hardness (H_s) of the substrate, a hardness (H_f) of the thin film, a complex hardness (H_c), a volume (V_s) of a plastic zone of a substrate, and a volume (V_f) of plastic zone of the thin film; a step of comparing the hardness (H_s) of the substrate with the hardness (H_f) of the thin film; a step of calculating an interface variable (x^3); and a step of calculating a work (W_adhesion) due to an interface bonding force, thereby obtaining a quantitative interface bonding force not affected by the test conditions.;COPYRIGHT KIPO 2016