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A Survey Addressing On-Chip Interconnect: Energy and Reliability Considerations

机译:一项针对片上互连的调查:能源和可靠性注意事项

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Scaling CMOS process technology continues to enable increased levels of system integration, leading to on-chip communication demands beyond what traditional digital signalingtechniques can efficiently provide with sufficient reliability. In this paper we survey the state of the art of on-chip interconnect techniques for improving performance, energy, and reliability and provide a review of interconnect reliability considerations. Finally, we provide a case study to evaluate the efficiency of error correcting codes on a state-of-the-art energy-efficient low-swing interconnect.
机译:扩展CMOS工艺技术继续使系统集成水平提高,从而导致片上通信需求超出了传统数字信号技术可以有效提供的足够的可靠性。在本文中,我们调查了用于改善性能,能耗和可靠性的片上互连技术的现状,并提供了互连可靠性考虑因素的综述。最后,我们提供了一个案例研究,以评估最新的节能低摆幅互连上的纠错码的效率。

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