Internal Stress in Nickel Thin Films Affected by Additives in Electrodeposition

摘要

The effect of additives on the internal stress in electrodeposited nickel thin films has been investigatedusing a bent strip measurement and X-ray diffraction. The additives such as saccharin sodium and p- toluenesulfonamide cause a decrease in the internal stress and a shift from a tensile stress to acompressive stress. The changes in the internal stress are described as a power law deviated from theinternal stress in the nickel thin film generated from a solution free of the additive. This indicates thatwithin a framework of the dynamic scaling theory the effect of the additive is equivalent to a quenchednoise that disturbs the surface growth by its adsorption on active sites in the nickel thin film. Theinternal stress is found to be summarized as a unified equation.