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首页> 外文期刊>IEICE Electronics Express >The characteristics of fluorinated gate dielectric AlGaN/GaN MIS-HEMT
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The characteristics of fluorinated gate dielectric AlGaN/GaN MIS-HEMT

机译:氟化栅电介质AlGaN / GaN MIS-HEMT的特性

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References(16) In this letter, a normally-off AlGaN/GaN MIS-HEMT using fluorinated gate dielectric was presented. The fluorine ions were injected into the Al2O3 gate dielectric to obtain positive threshold voltage (Vth) as well as avoiding the plasma induced to the GaN channel layer. Moreover the maximum transconductance of fluorinated gate MIS-HEMT has been improved compared with the non-treated MIS-HEMT. Furthermore, the fluorine ions injected into the Al2O3 gate dielectric could decrease the trap states density (DT) and time constant (τT) at the Al2O3/GaN interface. The normally-off MIS-HEMT showed a very high drain current of 507 mA/mm and Vth of 0.6 V.
机译:参考文献(16)在本文中,提出了一种使用氟化栅极电介质的常关型AlGaN / GaN MIS-HEMT。将氟离子注入到Al2O3栅极电介质中,以获得正阈值电压(Vth)并避免将等离子体感应到GaN沟道层。此外,与未处理的MIS-HEMT相比,氟化栅极MIS-HEMT的最大跨导得到了改善。此外,注入到Al2O3栅极电介质中的氟离子会降低Al2O3 / GaN界面处的陷阱态密度(DT)和时间常数(τT)。常关MIS-HEMT的漏极电流非常高,为507 mA / mm,Vth为0.6 V.

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