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STRUCTURAL PROPERTIES AND THERMOELECTRIC POWER OF THERMALLY EVAPORATED InSbTe3THIN FILMS

机译:热蒸发InsbTe3薄膜的结构性质和热电性能

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Stoichiometric thin films of different thickness (~50 – 150 nm) of InSbTe3were prepared by thermally evaporated technique, onto pre-cleaned glass substrates at ~ 298 K. The as-deposited films are non-crystalline and the crystallinity occurs on annealing at T ≥ 373 K. The analysis of X-ray data using a special computer program for an unknown system confirmed that InSbTe3compound has orthorhombic structure with lattice constants a = 16.39 ± 0.004 ., b = 10.21 ± 0.0063 ., c = 3.98 ± 0.0019 ., and cell volume, V = 666.64 ± 0.0043 .3. Both dark electrical resistivity ρ and thermoelectric power were measured in the temperature range (~303-423 K). Seebeck coeficient was found to be positive over entire temperature range, indicating that InSbTe3films are p-type semiconducting materials. Also, the variation of the mobility with the temperature has been estimated. The results were interpreted acording to the grain boundary potential barrier model and the presence of small polaron with energy, WP~ 0.05 ± 0.009 eV
机译:通过热蒸发技术在〜298 K的预清洁玻璃基板上制备了不同厚度(约50 – 150 nm)的InSbTe3化学计量薄膜。沉积的薄膜是非晶态的,并且在T≥退火时发生结晶373 K.使用特殊计算机程序对未知系统进行的X射线数据分析确认InSbTe3化合物具有正交晶格结构,其晶格常数a = 16.39±0.004。,b = 10.21±0.0063。,c = 3.98±0.0019。,和细胞体积,V = 666.64±0.0043 .3。在温度范围(〜303-423 K)下测量了暗电阻率ρ和热电功率。发现塞贝克系数在整个温度范围内为正,表明InSbTe3薄膜是p型半导体材料。而且,已经估计了迁移率随温度的变化。根据晶界势垒模型和能量为WP〜0.05±0.009 eV的小极化子的存在解释了结果

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