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Microhardness of resin-based materials polymerized with LED and halogen curing units

机译:与LED和卤素固化单元聚合的树脂基材料的显微硬度

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The purpose of this study was to evaluate the microhardness of resin-based materials polymerized with a LED (light-emitting diode) light-curing unit (LCU) and a halogen LCU. Twenty cylindrical specimens (3.0 mm in diameter and 2.0 mm high) were prepared for each tested material (Z100, Definite and Dyract). Specimens were light-cured with two LCUs (Ultraled and Curing Light 2500) for either 40 or 60 s on their top surfaces. Hardness was measured on top and bottom surfaces of each specimen. Statistical analysis was done by ANOVA and Tukey's test (p
机译:这项研究的目的是评估用LED(发光二极管)光固化单元(LCU)和卤素LCU聚合的树脂基材料的显微硬度。对于每种测试材料(Z100,定性和Dyract),准备了二十个圆柱试样(直径3.0毫米,高2.0毫米)。用两个LCU(Ultraled and Curing Light 2500)在其顶表面上将样品光固化40或60 s。在每个样品的顶面和底面测量硬度。统计分析是通过方差分析和Tukey检验(p

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