机译:具有各向异性导电膜接头的先进薄柔性柔性互连技术的过程相关热机械行为
Department of Aerospace and Systems Engineering, Feng Chia University, Taichung, Taiwan, ROC;
Department of Aerospace and Systems Engineering, Feng Chia University, Taichung, Taiwan, ROC;
Department of Power Mechanical Engineering, National Tsing Hua University, Hsinchu, Taiwan, ROC;
Electronics and Optoelectronics Research Laboratories, ITRI, Hsinchu, Taiwan, ROC;
Department of Power Mechanical Engineering, National Tsing Hua University, Hsinchu, Taiwan, ROC;
Flexible electronics; Thin-flip-chip-on-flex; Process simulation; Finite element modeling; Anisotropic conductive film; Four-point bending; Static bending; Four-point probe measurement;
机译:各向异性导电膜作为MEMS器件倒装芯片互连技术的可行性
机译:基于纳米线的各向异性导电薄膜技术的热力学行为
机译:温度波动下不同力作用下各向异性导电膜接头的行为
机译:基于新型纳米线的各向异性导电膜组件的过程依赖性热机械分析和设计
机译:使用各向异性导电胶膜的集成电路芯片互连性能。
机译:使用导电纱和互连技术开发用于姿势监测的IMU集成式衣服
机译:特殊文章:先进的装配和包装技术主题。使用各向异性导电膜进行连接的传导性能。