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Virtual Flash Chips: Reinforcing the Hardware Abstraction Layer to Improve Data Recoverability of Flash Devices

机译:虚拟闪存芯片:增强硬件抽象层以提高闪存设备的数据可恢复性

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摘要

The market trend of flash memory chips has been toward high density but with low reliability. The rapidly increasing bit error rates and emerging reliability issues of the coming triple-level cell and even three-dimensional flash chips will expose users to extremely high risks for storing data in such low reliability storage media. With these concerns in mind, this paper rethinks the layer design of flash devices and proposes a complete paradigm shift to re-configure physical flash chips of potentially massive parallelism into better “virtual chips”, in order to improve the data recoverability in a modular and low-cost way. The concept of virtual chips is realized by reinforcing the hardware abstraction layer without continually complicating the conventional flash management software of the flash translation layer. The capability and compatibility of the proposed design were verified by both property analysis and a series of experiments with encouraging results.
机译:闪存芯片的市场趋势已朝着高密度但可靠性低的方向发展。即将出现的三级单元甚至是三维闪存芯片的误码率的迅速提高和出现的可靠性问题,将使用户面临将数据存储在这种低可靠性存储介质中的极高风险。考虑到这些问题,本文重新考虑了闪存设备的层设计,并提出了一个完整的范式转换,以将可能具有大规模并行性的物理闪存芯片重新配置为更好的“虚拟芯片”,以提高模块化和模块化的数据可恢复性。低成本的方式。虚拟芯片的概念是通过增强硬件抽象层来实现的,而不会持续使闪存转换层的常规闪存管理软件复杂化。通过性能分析和一系列实验,验证了所提出设计的功能和兼容性,并获得了令人鼓舞的结果。

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