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Influence of resin cement thickness and temperature variation on mechanical behavior of dental ceramic fragment restoration

机译:树脂胶粘剂厚度和温度变化对牙科陶瓷碎片修复力学性能的影响

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To evaluate the stress behavior of ceramic fragment restoration, varying the thickness of the cement layer and intraoral temperature variation. A solid model of a upper lateral incisor was obtained and a defect at enamel distal/incisal edge was restored with a ceramic fragment. Based on this initial model, 4 different models (M) were built: M1 - absence of cement layer (CL) (0 mu m of thickness); M2 - CL with an uniform thickness of 50 mu m; M3 - CL with 50 mu m at the margin of ceramics and 100 mu m in the inner area far from margins; M4 - CL with 50 mu m at the margin of ceramics and 200 mu m in the inner area far from margins. The environment temperature changed from 5 degrees C to 50 degrees C in 4 increments. The finite element analysis was performed. Increase the cement layer thickness generated higher stress levels on ceramic surface in all temperatures, as well as on cement interface. In general hot temperature was the worst scenario for ceramic fragments integrity, since tensile and compressive stress were more intense. The maximum principal stress on ceramic fragment was found 90 MPa for M4 at 50 degrees C, followed for M3 (87 Mpa). For CL, the peak of stress was found for M3 at 5 degrees C (47 MPa). Is it possible to conclude that thick resin cement layer contribute to higher stress concentration on ceramic fragment, and extremely hot temperatures increase the risk of structural failure, since both ceramic and cl are exposed to higher compressive and tensile stresses.
机译:为了评估陶瓷碎片修复的应力行为,改变水泥层的厚度和口腔内温度的变化。获得了上侧切牙的实体模型,并用陶瓷碎片修复了釉质远侧/切牙边缘的缺损。在此初始模型的基础上,构建了4种不同的模型(M):M1-缺少水泥层(CL)(厚度为0微米); M2-CL,均匀厚度为50微米; M3-CL,陶瓷边缘为50微米,远离边缘的内部区域为100微米; M4-CL,陶瓷边缘的厚度为50μm,远离边缘的内部区域为200μm。环境温度以4增量从5摄氏度更改为50摄氏度。进行了有限元分析。增加水泥层厚度会在所有温度下在陶瓷表面以及水泥界面上产生更高的应力水平。通常,高温是陶瓷碎片完整性最差的情况,因为拉伸应力和压缩应力更加强烈。发现陶瓷碎片在50摄氏度时的最大主应力为90 MPa,随后为M3(87 Mpa)。对于CL,在5摄氏度(47 MPa)下发现了M3的应力峰值。可以得出这样的结论:较厚的树脂胶结层有助于提高陶瓷碎片上的应力集中,并且极高的温度会增加结构破坏的风险,因为陶瓷和 cl都承受较高的压缩应力和拉伸应力。

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