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Interconnections in Multi-core Architectures: Understanding Mechanisms, Overheads and Scaling

机译:多核体系结构中的互连:了解机制,开销和扩展

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This paper examines the area, power, performance, and design issues for the on-chip interconnects on a chip multiprocessor, attempting to present a comprehensive view of a class of interconnect architectures. It shows that the design choices for the interconnect have significant effect on the rest of the chip, potentially consuming a significant fraction of the real estate and power budget. This research shows that designs that treat interconnect as an entity that can be independently architected and optimized would not arrive at the best multi-core design. Several examples are presented showing the need for careful co-design. For instance, increasing interconnect bandwidth requires area that then constrains the number of cores or cache sizes, and does not necessarily increase performance. Also, shared level-2 caches become significantly less attractive when the overhead of the resulting crossbar is accounted for. A hierarchical bus structure is examined which negates some of the performance costs of the assumed baseline architecture.
机译:本文研究了片上多处理器上片上互连的面积,功耗,性能和设计问题,试图全面介绍一类互连体系结构。它表明,互连的设计选择会对芯片的其余部分产生重大影响,可能会消耗不大的空间和功率预算。这项研究表明,将互连视为可以独立进行架构和优化的实体的设计不会达到最佳的多核设计。给出了几个示例,表明需要仔细的协同设计。例如,增加互连带宽需要占用面积,从而限制了内核数或缓存大小,并不一定提高性能。同样,如果考虑了所产生的交叉开关的开销,则共享的2级缓存的吸引力将大大降低。检查了分层总线结构,该结构消除了假定的基准体系结构的一些性能成本。

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