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Two-scale concurrent topology optimization method of hierarchical structures with self-connected multiple lattice-material domains

机译:自连接多格子材料域分层结构的双级并发拓扑优化方法

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This paper proposes a two-scale concurrent topology optimization method for the structures composed of multiple lattice materials, in which the microstructures of lattice materials, the structural topology and the distribution of multiple lattice materials are concurrently optimized with the connection between different lattice materials assured. In the two-scale framework, a multi-domain self-connected material interpolation model is defined to describe the topology (the distribution of holes), the distribution of different lattice materials and their interfaces on the macroscale. It is emphasized that the interface region between different lattice materials can be accurately identified in the macro-interpolation. Thus, only microstructures of the interface region need to preset a frame-undesignable domain as a simple but reliable geometric connection measure. At the same time, the Solid Isotropic Material with Penalization (SIMP) interpolation is applied to model the microstructural topology on the microscale. Besides, the homogenization method is taken as a bridge between two scales, which evaluates the effective material properties of microstructures. The standard optimized formula which considers structural compliance as the objective function is used to design the structure. Several 2D and 3D examples verify the effectiveness of the proposed method and the superior mechanical properties of the designable structure.
机译:本文提出了一种双级并发拓扑优化方法,其由多个晶格材料组成的结构,其中晶格材料的微观结构,结构拓扑结构和多个晶格材料的分布在另外的不同晶格材料之间的连接和多晶硅材料的同时优化。在两个尺度框架中,定义了一种多域自连接材料插值模型来描述拓扑(孔的分布),不同晶格材料的分布及其对宏观上的界面。强调,可以在宏插值中准确地识别不同晶格材料之间的接口区域。因此,界面区域的仅微结构需要预设帧 - 未使用的域作为简单但可靠的几何连接测量。同时,将阳性各向同性材料与惩罚(SIMP)插值应用于模拟微观尺寸的微观结构拓扑。此外,将均质化方法作为两种尺度之间的桥梁,这评估了微观结构的有效材料特性。作为目标函数认为结构顺应性的标准优化公式用于设计结构。几个2D和3D示例验证了所提出的方法的有效性和可设计结构的优越机械性能。

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