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Full-range bondstress-slip model for externally bonded FRP plates including a frictional component

机译:用于外部粘合FRP板的全范围粘合剂滑动型号,包括摩擦部件

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Bondstress-slip models of externally bonded FRP plates have long been quantified using push/pull shear tests in which the bonded joint is slightly greater than the effective length of the plate. This inhibits the formation of a frictional component that may arise in long bonded joints. Moreover, previous researchers have used several factors to represent the bondstress-slip model parameters which gave a rise to a number of models. With that in mind, the first aim of this study was to assess the factors that affect the bondstress-slip parameters (tau(max), delta(1) and delta(max)), and to propose a simplified bilinear bondstress-slip model that correlates well with experimental data. The second objective was to predict the frictional component in the bondstress-slip model that develops in FRP plated flexural members using a partial-interaction displacement-based approach, assess the factors that affect the frictional component and investigate the debonding mechanism of FRP plated members with a frictional component. As such, a database consisting of 98 pull/push shear tests available in the open literature was assembled and used to assess the factors that influence the bilinear bondstress-slip model parameters. Subsequently, a simplified bilinear bondstress-slip model was proposed and validated against 288 pull/push shear test results. Next, 8 FRP plated beams were investigated using a displacement-based analysis where it was seen that the frictional component depended largely on the length of the plated members. Also, it was seen that poor correlation with experimental results was observed when a bilinear model without a frictional component was used in the analysis, where the predicted ultimate strength was 66 - 78% of the experimental value. The findings of this study illustrate the importance of considering the frictional component in the bondstressslip model, and how this may affect the strength, deformation and ductility of the plated member.
机译:外部粘合FRP板的Bondstress-Slip模型长期以来使用推/拉剪切测试量化,其中粘合接头略大于板的有效长度。这抑制了在长粘合的关节中产生的摩擦部件的形成。此外,以前的研究人员使用了几个因素来代表BondStress-Slip模型参数,该参数产生了许多模型。考虑到这项研究的首次目的是评估影响Bondstress滑移参数的因素(TAU(MAX),Delta(1)和Delta(Max)),并提出简化的双线性粘合剂滑移模型与实验数据很好地相关。第二个目的是预测使用基于部分交互位移的方法在FRP电镀弯曲构件中开发的粘合剂滑移模型中的摩擦分量,评估影响摩擦部件的因素,并研究FRP电镀构件的剥离机制摩擦部件。因此,组装开放文献中可用的98拉/推剪试验的数据库,并用于评估影响Bilinear Bondstress滑移模型参数的因素。随后,提出了一种简化的双线性粘合剂滑移模型并验证了288拉/推剪的测试结果。接下来,使用基于位移的分析研究了8个FRP电镀梁,在那里看到摩擦分量在很大程度上取决于电镀构件的长度。此外,可以看出,当在分析中使用没有摩擦组分的双线性模型时,观察到与实验结果的相关性差,其中预测的最终强度为实验值的66-78%。该研究的发现说明了考虑债券硬化模型中的摩擦部件的重要性,以及这可能如何影响镀部构件的强度,变形和延展性。

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