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In-situ observation of microscopic damage in adhesively bonded CFRP joints under mode I and mode II loading

机译:在模式I和模式II载荷下粘合CFRP接头的微观损伤的原位观察

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Microscopic failure mechanisms in adhesively bonded joints of carbon fiber reinforced polymer (CFRP) structures were studied, and in-situ observation during fracture toughness tests under mode I and mode II loading were carried out. Strain in the adhesive layer was quantitatively evaluated by applying the digital image correlation (DIC) method to micrographs. Strain concentration was observed along the CFRP/adhesive interface under mode I loading. On the other hand, strain concentration and microcracks around the polyester carrier was observed under mode II loading. The macroscopic crack growth occurred due to the coalescing of microcracks under mode II loading. The maximum principal strain in adhesive resin under mode II loading at the onset of crack growth was significantly larger than that under mode I loading. The effects of distance from specimen edge on the crack growth behavior were also studied using the X-ray computed tomography.
机译:研究了碳纤维增强聚合物(CFRP)结构的胶接接头的微观破坏机理,并在模式I和模式II载荷下对断裂韧性测试进行了现场观察。通过将数字图像相关性(DIC)方法应用于显微照片来定量评估粘合剂层中的应变。在模式I加载下沿CFRP /胶粘剂界面观察到了应变浓度。另一方面,在模式II载荷下观察到聚酯载体周围的应变集中和微裂纹。宏观裂纹扩展是由于模式II载荷下微裂纹的聚结而发生的。在裂纹扩展开始时,在模式II加载下,粘合树脂的最大主应变显着大于在模式I加载下的粘合树脂。还使用X射线计算机断层扫描技术研究了距试样边缘距离对裂纹扩展行为的影响。

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