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Experimental and Modeling Study of Breakup Behavior in Silicone Jet Dispensing for Light-Emitting Diode Packaging

机译:发光二极管封装硅射流分配中破裂行为的实验和建模研究

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Silicone jet dispensing has grown increasingly common in light-emitting diode (LED) packaging owing to its high speed and low cost. However, differences in breakup behavior result in different silicone jetting volumes that create challenges in maintaining dispensing volume consistency during silicone jet dispensing process; this severely affects the performance of LED packaging. To reveal the breakup behavior during the jet dispensing process, the experimental and modeling studies were conducted. First, the ultrafast breakup process was experimentally observed using a high-speed camera, which shows that this process only requires approximately 50 ms. Then, an analytical model was developed and verified through an experiment. Using this analytical model, the effects of initial disturbance amplitude, initial disturbance wavelength, and thread length on the thread breakup were studied. The simulation demonstrated that it is necessary to control the disturbance amplitude under 0.005 for volume consistency in jet dispensing; thus, a moving work piece rather than a moving nozzle is recommended in jet dispensing. A disturbance wavelength between 0.3 and 0.6 mm is beneficial for both thread breakup and high-volume consistency. Thread length has little effect on the breakup position but significant effects on the volume consistency and breakup time. A low substrate increases the volume and the consistency of thread breakup. This paper will provide a useful guide for dispenser designs of modern LED packages.
机译:由于其高速和低成本,有机硅喷射点胶在发光二极管(LED)封装中已变得越来越普遍。但是,破裂行为的差异会导致不同的硅酮喷射量,这给在硅酮喷射分配过程中保持分配体积一致性带来了挑战。这严重影响了LED封装的性能。为了揭示喷射分配过程中的破裂行为,进行了实验和模型研究。首先,使用高速相机通过实验观察到超快破裂过程,这表明该过程仅需要大约50毫秒。然后,开发了分析模型并通过实验进行了验证。使用该分析模型,研究了初始扰动幅度,初始扰动波长和线长对断线的影响。仿真表明,有必要将扰动幅度控制在0.005以下,以实现喷射分配的体积一致性。因此,在喷射分配过程中,建议使用运动的工件而不是运动的喷嘴。 0.3毫米至0.6毫米之间的干扰波长有利于断线和大体积一致性。螺纹长度对分手位置影响很小,但对体积一致性和分手时间影响很大。较低的基材会增加体积和断线的一致性。本文将为现代LED封装的点胶机设计提供有用的指南。

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